pulse plating
Advantages:
Possibilities:
- Increase of the deposit homogeneity due to a higher throwing power even at complex shaped parts
- Increased layer density, elimination of pores
- Reduction of raw materials and organic bath additives
- Improvement of the resulting layer properties e.g. hardness
- Acceleration of your galvanic processes
- Functionalizing by combination with dispersion coating
Features:
 | Cathodc puls(es) Anodic puls(es) |
Specifications:
- Reduction of the deposited crystallite size starting from microns with DC down to nanocrystalline layers using pulse plating
- Significant increase in density and homogeneity of the deposited metal layers
- Dramatical improvement of the layer properties e.g. the corrosion stability
- Controlling your alloy composition just altering the pulse sequence
- Tailor the microstructure of your deposit by modifying the pulse sequence
- Most of the systems nickel, copper, gold, silver, rhodium, chromium, zinc and tin can be easily transferred to pulse plating
- Rack plating, barrel plating and continous strip plating processes can be realised
- Knowledge based definitions of the pulse sequence for best results
- Technical realisation by specialists even in existing plating lines
- Adaptation of the method is possible in various plating baths and electrolytes
High-Tech surface finishing for High-Tech applications!
A broad field of high precision and high performance applications for tool, machine and electronic industry can be optimised.
Example of use: Pulse plating of nickel:
- Reduction of the plating time due to a higher deposit uniformity
- The uniformity can be improved from a ratio of 1.5 (edges to corners) at DC plating to a ratio better than 1:1.5 with pulse plating
- Reduction of time and material
- Increased corrosion stability due to dense, compact nickel layers
Altering the deposit structure:
By adjusting the pulse sequence, the micro structure of the nickel layer can be modified e.g. from columnar growth to lamellar growth!
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