Numerical process simulation

Cell Design

• Fast computer simulations replace time-consuming „trial and error“ experiments
• Save material costs and eliminate scrap by closely meeting specifications
• Superb deposit homogeneity due to a high throwing power even at complexly shaped parts
• High flexibility due to a modular structure enabling to custom-fit the software
• Industrially proved process in several applications in the field of surface finishing
• Optimization of all galvanic depositions, pulse plating processes, anodizing, electrolytic etching and continuous strip plating
• Allowing innovative process development and reduces time-to-production
• Easy to use and clearly structured user interface

• Production of dense, stress free alloy layers using pulse plating
• Suitable for all tasks in industrial production as well as for research and development
• Integration of the exact cell geometry, shieldings and auxiliary electrodes
• Calculation of the influence of the electrolyte flow on the galvanic deposition
• Computation and accuracy may be adjusted to accommodate the customer needs
• Results are the current / potential distributions, the deposit thickness distribuation, the fluid flow field and the concentration profiles
• Consideration of the electrode kinetics and mass transport control
• Simulation of real cell geometries via cross section analysis and three dimensional axi-symmetric cells
• User-customizable database of the chemical and physical properties of the most commonly used electrolyte systems
• The software is specifically designed and optimized for PCs running under Windows 95, 98, ME, 2000, NT and XP
• Automated generation of all required input process parameters with the L-Cell, only taking minutes of measurement

High-Tech surface finishing for highest demands!

• Fluid flow including agitation, translating and/or rotating electrodes, fully integrated with the electrochemical simulator
• Multiple electrode reactions (alloy plating, gas co-evolution)
• Corrosion and cathodic protection
• Film covered electrodes (passivation, anodizing)
• Resistive deposit including barrier layers (anodizing)
• Battery/fuel cell simulation - under load
• Reel to reel (continous strip) plating
• Moving boundaries for simulating electroforming, electro-etching and electrochemical machining (ECM)
• Pulse and Pulse Reverse Plating
• Variable kinetics along electrodes

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